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Spherical Aluminum oxide powder 50um 20um 10um 5um 2um

Spherical aluminum oxide powder is a good filling powder as thermal conductivity media. It is produced from low soda aluminum oxide aluminum oxide by fire fusing process. The sphere shape leads to low BET surface area and high flowability. In the meantime, spherical alumina powder is of high thermal conductivity and low oil absorption rate. It is widely used as a thermal conductive filler in electronics, epoxy resin, thermal insulating media in ceramic sintering, thermal spaying powder, etc.

$9.88 $9.68 /MT

Spherical Aluminum oxide powder 50um 20um 10um 5um 2um

 

Description:

Spherical aluminum oxide powder is a good filling powder as thermal conductivity media. It is produced from low soda aluminum oxide aluminum oxide by fire fusing process. The sphere shape leads to low BET surface area and high flowability. In the meantime, spherical alumina powder is of high thermal conductivity and low oil absorption rate. It is widely used as a thermal conductive filler in electronics, epoxy resin, thermal insulating media in ceramic sintering, thermal spaying powder, etc.

Characteristic:
  1. High Al2O3 purity is more than 99.8%. Low Na2O content less than 0.1%.
  2. High spherical rate, good flowability without damage for grinding.
  3. Low oil absorption rate makes it suitable for filler material.
  4. Low BET surface area and low Viscosity mixed with resin.
  5. Higher thermal conductivity than angular aluminum oxide.

 

Physical properties:
ItemsHXSA02HXSA05HXSA10HXSA20HXSA45HXSA70
BET(m2/g)1.270.360.170.140.120.12
Specific Gravity(g/cm3)3.703.743.683.723.813.81
conductivity (us/cm)554755
PH7.797.707.907.627.807.80
Moisture (%)0.030.030.030.030.030.03
Roundness (%)988698989898
D10 Value(um)0.125102325
D50 Value(um)2511205075
D90 Value(um)510224080120

 

Typical Chemical Composition:
ItemsHXSA02HXSA05HXSA10HXSA20HXSA45HXSA70
Al2O3(%)99.899.899.899.899.899.8
SiO2(ppm)1097474987474
Fe2O3(ppm)10617012029170170
Na2O(ppm)6320019039200200

 

Application:
  1. Fillers for semiconductor sealing materials
  2. Various resin filling materials. Especially suitable for improving the thermal conductivity and surface hardness of silicone rubber, epoxy resin, various engineering plastics, etc.
  3. Setting powder for ceramic sintering
  4. Grinding and polishing
  5. Thermal spraying materials
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