White aluminum oxide 800# for Semiconductor package blasting

Semiconductor packaging is one of the important semiconductor manufacturing processes for connecting between chips and external circuits. Sandblasting of packaging materials is a necessary step for surface treatment. White aluminum oxide 800# is an ideal abrasive medium for metal Semiconductor package blasting. White fused alumina is an artificial abrasive made by high-temperature electric melting. It has excellent self sharpening, hardness, and grinding force.

The function of white aluminum oxide powder for Semiconductor package blasting:

1. Improve surface quality.

Sandblasting can remove oxides, pollutants, and small defects from semiconductor surfaces. It makes the surface smoother and improving packaging quality and reliability.

2. Enhance adhesion.

Through sandblasting treatment, the semiconductor surface forms a micro roughness suitable for coating adhesion. Thus, it enhances the bonding force between the packaging material and the semiconductor chip, ensuring the firmness of the packaging.

3. Precise control of surface characteristics.

Sandblasting treatment can accurately control the roughness, shape, and optical properties of semiconductor surfaces. As a result, it meets the high-precision requirements in the packaging process.