Silicon wafer polishing powder

Wafer refers to the silicon wafer used in the manufacture of semiconductor integrated circuits. Silicon wafers can be processed into various circuit element structures.  Choose the proper polishing powder is very important.

Grinding, polishing, and thinning of monocrystalline silicon wafers are important processes for processing silicon wafers. After cutting the wafer, the surface will have cutting damage and scratches. That polishing work is a precise polishing process.

Generally, white aluminum oxide powder of 1200 mesh, 1500 mesh, and 2000 mesh are grinding media as Silicon wafer polishing powder. The polishing effect is relatively good. The surface of the silicon wafer has no scratches and can reach a surface roughness of 10-20um. That makes preparation for the mirror polishing effect of the silicon wafer substrate grinding.

The white aluminum oxide powder from Haixu Abrasives has the characteristics of even particle size (good PSD result), high hardness, and high purity, which avoids the disadvantages of large particles damage to the surface in grinding and polishing.