Platelet alumina powder 15um 20um for gallium arsenide wafer polishing
Platelet alumina powder 15um 20um is suitable for gallium arsenide wafer polishing. The quality is close to Fujimi PWA15 and Microgrit WCA15. Because the properties of aluminum oxide particles are similar to platelets, it is also called plate-shaped aluminum oxide powder. It is made by high-temperature calcination and special additives to make aluminum oxide have a platelet crystal structure and try to reduce the conversion of aluminum oxide to alpha phase to ensure its hardness and uniformity as abrasive powder and polishing powder. The special tabular structure of platelet aluminum oxide can prevent scratches during wafer grinding, greatly improving the yield rate of wafers.
The features of Platelet alumina powder 15um 20um for gallium arsenide wafer polishing:
- The Platelet alumina powder produced by Haixu Abrasives can achieve the grinding effect of imported sheet-like aluminum oxide powder compared to imported products.
- The crystal form is flat without edges and corners, and during grinding, the abrasive particles produce a flat sliding effect between the workpiece, making it less prone to scratches.
- High hardness and strong grinding force. Plate shape alumina has properties similar to corundum α- Al2O3 crystal phase, suitable for grinding and polishing of most materials.
- Low magnetic content, high cleanliness, and high particle size consistency.
- High melting point, high mechanical strength, and high grinding efficiency.
- The particle size is controllable and can be obtained from 3 to 50 microns.
- The flatness of the particles makes the platelet alumina powder easy to disperse, making it suitable for making abrasives or grinding liquids.
- It has corrosion resistance, strong chemical stability, and superior antioxidant performance, and will not react with liquid media in the grinding fluid.
- Large specific surface area, surface activity and adhesion due to fused corundum.
- Platelet alumina is easy to disperse, and the powder is not easy to aggregate on the surface of the wafer, causing accumulation and affecting the polishing smoothness.
Chemical composition of Platelet alumina powder 15um 20um for gallium arsenide wafer polishing
| Item | Standard Value | Tested Value |
| Al2O3 | ≥99.5% | 99.60% |
| Fe2O3 | ≤0.04% | 0.032% |
| SiO2 | ≤0.03% | 0.02% |
| Na2O | ≤0.2% | 0.15% |
Physical properties of Platelet alumina powder 15um 20um for gallium arsenide wafer polishing
| Item | Standard Value | Tested Value |
| Specific Gravity(g/cm3) | 3.96-3.98 | 3.98 |
| Mohs hardness | ≥9 | 9.0 |
Available Sizes
| Specification | D3(um) | D50（um） | D94（um） |
| HXTA20 | 20.9-24.1 | 13.1-15.3 | 8.2-9.8 |
| HXTA15 | 14.8-17.2 | 9.4-11 | 5.8-6.8 |
| HXTA12 | 11.8-13.8 | 7.6-8.8 | 4.5-5.3 |
| HXTA09 | 8.9-10.5 | 5.9-6.9 | 3.3-3.9 |
Application:
- Grinding of semiconductor silicon wafers and quartz crystal materials.
- Polishing of compound semiconductor materials such as gallium arsenide, indium phosphide, lithium niobate, etc.
- Grinding and polishing of sapphire crystals, etc.
Production:
Package:
10kgs/bag,20kgs/ Carton,1000kgs/Pallet
FAQ
A: Where is the original country of the aluminum oxide powder?
Q: The platelet calcined aluminum oxide powder is made in China.
A: Can this platelet alumina powder replace FUJIMI PWA 15?
Q: It can get the same grinding effect as FUJIMI PWA 15. The performance is about 80-90% of PWA15 or WCA15.
A: Is the platelet aluminum oxide made from Calcining or fusing process?
Q: It is made from a calcining process at about 1200 degrees. The sieving and water treatment processes are in the same production line of fused aluminum oxide powder.
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