High Thermal conductivity 99.9% Spherical alumina powder
Description:
High Thermal conductivity 99.9% Spherical alumina powder is produced from low soda aluminum oxide by fire fusing process. The sphere shape leads to low BET surface area and high flowability. In the meantime, spherical alumina powder is of high thermal conductivity and low oil absorption rate. It is widely used as thermal conductive filler in electronics, epoxy resin, thermal insulating media in ceramic sintering, thermal spaying powder, etc.
Characteristic:
- High Al2O3 purity more than 99.8%. Low Na2O content less than 0.1%.
- High spherical rate, good flowability without damage for grinding.
- Low oil absorption rate make it suitable for filler material.
- Low BET surface area and low Viscosity mixed with resin.
- Higher thermal conductivity than angular aluminum oxide.
Physical properties:
| Items | BET(m2/g) | Specific Gravity(g/cm3) | conductivity (us/cm) | PH | Moisture (%) | Roundness (%) | D10 Value(um) | D50 Value(um) | D90 Value(um) |
| HGSA01 | 1.69 | 3.71 | 6.07 | 7.79 | 0.03 | 98 | 0.58 | 1.03 | 2.14 |
| HGSA02 | 1.27 | 3.72 | 5.40 | 7.70 | 0.03 | 96 | 0.69 | 2.18 | 5.24 |
| HGSA05 | 0.36 | 3.74 | 5.65 | 7.90 | 0.03 | 98 | 2.54 | 5.52 | 9.09 |
| HGSA10 | 0.17 | 3.76 | 4.05 | 7.62 | 0.03 | 98 | 4.18 | 10.03 | 18.46 |
| HGSA15 | 0.14 | 3.86 | 1.83 | 7.80 | 0.03 | 98 | 7.03 | 15.11 | 24.06 |
| HGSA20 | 0.11 | 3.80 | 6.87 | 7.80 | 0.03 | 98 | 10.5 | 20.8 | 37.24 |
| HGSA30 | 0.10 | 3.76 | 7.95 | 7.40 | 0.05 | 96 | 16.88 | 30.52 | 48.87 |
| HGSA40 | 0.07 | 3.81 | 4.65 | 7.45 | 0.03 | 98 | 23.77 | 41.54 | 66.44 |
| HGSA70 | 0.05 | 3.87 | 6.18 | 7.70 | 0.03 | 96 | 44.32 | 71.54 | 106.5 |
| HGSA90 | 0.06 | 3.88 | 8.15 | 7.35 | 0.05 | 95 | 55.23 | 87.96 | 134.92 |
| HGSA120 | 0.06 | 3.82 | 2.60 | 7.46 | 0.03 | 96 | 90.95 | 122.39 | 172.72 |
Typical Chemical Composition
| Items | Guarantee Value | Typical Value |
| Al2O3(%) | 99.9 | 99.94 |
| SiO2(ppm) | 500 | 373 |
| Fe2O3(ppm) | 200 | 120 |
| Na2O(ppm) | 200 | 107 |
Application:
- Fillers for semiconductor sealing materials
- Various resin filling materials. Especially suitable for improving the thermal conductivity and surface hardness of silicone rubber, epoxy resin, various engineering plastics, etc.
- Setting powder for ceramic sintering
- Grindingandpolishing
- Thermal spraying materials
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